Making Traceable and Accurate sub-THz Measurements for Wafer Test Applications.

To support the development of 6G and beyond mobile communication products, wafer S-parameters and RF measurements at sub-THz frequencies are becoming common, daily measurements for test engineers. Accuracy, repeatability and traceability in tests, particularly for active devices, are necessary requirements as test engineers collaborate among their colleagues and customers in labs of various geographical locations. In this talk, based on published IEEE papers, we are going to discuss how probe tip power calibration, continuity checks in banded sub-THz measurements, probe tip contact resistance monitoring as well as best practices in autonomous over-temperature high frequency measurements, can help to address these evolving test requirements.