Webinar Series—
Test Strategies for the Data Explosion
More data, more tests, more measurements. With industry partners, we discuss strategies for higher productivity and accurate results.
ON-DEMAND WEBINARS
Enabling Quantum Advantage: Overcoming Cryogenic I/O Bottlenecks
Available for on demand viewing
As quantum computing scales toward practical applications, cryogenic I/O systems are emerging as a critical bottleneck. In this joint webinar, FormFactor and Delft Circuits present their roadmaps to address the evolving challenges in cryogenic I/O over the next five years. Building on insights from our previous session, we will explore the increasing complexity of designing and fabricating scalable, high-integrity, and maintainable cryogenic interfaces.
We begin by outlining the current and future requirements for quantum computers, focusing on four key bottleneck categories:
- Physical I/O Scaling – Managing connections across RT, 4K, and mK stages, with emphasis on pre-cooling strategies.
- Signal Integrity – Addressing thermal loads, noise, S-parameters, and crosstalk.
- Modularity & Installability – Ensuring flexible and efficient system integration.
- Reliability & Maintenance – Designing for long-term operability and serviceability.
FormFactor will introduce these challenges from the perspective of a cryostat builder and the limits of scaling traditional chandelier style dilution refrigerators, while Delft Circuits will demonstrate how their technology roadmap aligns with and solves these bottlenecks. Join us to see how this partnership is paving the way for scalable quantum systems and accelerating the path to quantum advantage.
A Commercial Implementation of Modal Calibration to Improve GSSG Calibration
Available for on demand viewing
In RF testing, the goal of calibration is to remove the effects of the test setup, including cables, connectors, and adapters, so that the measured results accurately reflect the Device Under Test (DUT) itself. However, performing accurate on-wafer calibrations is challenging, particularly for differential topologies, as the coupling inherent to these precludes accurate measurements unless accounted for. Most traditional RF calibrations do not compensate for this coupling, resulting in inaccurate, and in some cases physically implausible, measurements.
Modal Calibration is one technique to characterise and remove this crosstalk, and is now available, for the first time, in a commercial calibration software.
This webinar will discuss RF calibration techniques, their limitations as applied to differential topologies, and present the Modal Calibration algorithm. Real-world validation results will be demonstrated to illustrate the accuracy improvements which can accrue from its use.
Smarter Probe Station Control with Velox 3.4.5
Available for on demand viewing
Join us for an in-depth look at Velox 3.4.5, the latest release of FormFactor’s probe station control software, packed with enhancements to boost performance, usability, and automation. We will take a look at its useful and efficient features, including advanced probe cleaning capabilities, an upgraded Workflow Guide with new Quick Start workflows, and expanded Autonomous Assistants for RF and High-Power measurements.
We’ll also explore the improved Motorized Positioner Setup for North/South layouts and the new Python 3 scripting environment with preloaded scientific libraries, enabling advanced automation and data analysis right out of the box.
Whether you’re focused on precision probing, streamlined workflows, or automation, this webinar will equip you with the knowledge to leverage Velox 3.4.5 to its fullest potential.
Overcoming Cryogenic Cabling Challenges within Dilution Refrigerators for Effectively Scaling Quantum Computing
Available for on demand viewing
A major challenge in scaling quantum computing systems is the severe limitation imposed by conventional cryogenic cabling within dilution refrigerators (DRs). As qubit counts increase, the volume of coaxial cables required quickly overwhelms the available space, creates excessive heat load that exceeds the DR's cooling capacity, and presents significant installation difficulties. These physical and thermal bottlenecks are a primary barrier to achieving higher qubit numbers within standard laboratory footprints and budgets.
This presentation will demonstrate how the innovative Cri/oFlex® technology from Delft Circuits (DC) can address the challenges faced in a FormFactor LF600 lab-scale dilution refrigerator. Including:
- Replacing coaxial cables with flexible, high-density stripline I/O systems featuring integrated filtering and specialized connectors for in a significantly smaller wiring volume and drastically reduced heat load per channel compared to conventional methods.
- Showing how this technology increases channel counts from 50 to 500 and enables up to 100 qubits within a lab-scale DR, without compromising performance.
- Comparing performance and density to conventional cabling within the context of DR cooling power
- Outlining the design, manufacturing, assembly, and installation process.
The presentation will conclude by highlighting the capability of DC cables to significantly increase channel density and qubit count within existing lab infrastructure. This approach offers options for even larger systems using bigger dilution refrigerators (DRs). It provides a scalable, robust, and user-friendly I/O system, offering a space- and budget-efficient path towards future, higher-qubit quantum processors.
Wincal- The Engineer’s Flexible RF Calibration Friend
Available for on demand viewing
WinCal is widely recognized in the industry for its robust RF calibration capabilities. However, it also offers a range of lesser-known features that make it an integral part of an analytics pipeline or a cost-effective, feature-rich test executive.
This webinar will showcase these advanced analysis features and demonstrate how WinCal can be seamlessly integrated with popular open-source software packages. By leveraging WinCal's powerful algorithms, users can significantly enhance its functionality. The latest 5.1 release introduces several new APIs designed to facilitate this integration, which will be discussed in detail.
Autonomous RF Measurements: Hands-Free Recalibration and Drift Compensation Across Multiple Temperatures
Available for on demand viewing
The Autonomous RF measurement assistant combines programmable positioners, a precise digital microscopy system, and advanced pattern recognition algorithms to enable fully autonomous, hands-free calibrations and measurements of RF devices over multiple temperatures.
This system manages the entire test flow for thermal and ambient testing, including automated calibration, monitoring to prevent measurement drift, and adjustment of probe spacing to account for growth and different probing geometries.
This presentation demonstrates the use of this approach for MLTRL calibrations both off and on wafer, showcasing the interaction between WinCal, Python, and analytical methods to evaluate calibration repeatability. Additionally, We will discuss the probe placement for unattended long-duration RF measurements.
Velox Dash™ - A Modern Touchscreen-Based Interface for Intuitive Probe Station Control
Available for on demand viewing
FormFactor's new companion device is here! Velox Dash™ enhances probe station control by providing access to the most used functionalities with just a touch of a finger. With its modern user interface, Velox Dash sets a standard for easy-to-use operation of engineering probe stations. The companion device combines an intuitive touch interface with an adaptable workplace.
Additionally, Velox Dash consolidates the functionalities of hardware joystick and eVue remote control into a single platform. The novel Velox Dash's user-centered design makes daily work a gratifying experience.
Attend this webinar and learn the latest features and functionality.
Inclined vs. Horizontal Waveguide Port Saver Approach in WR3.4 Band for On-Wafer Measurements
Available for on demand viewing
High frequency on-wafer measurements require waveguide based frequency extenders. As a company, FormFactor make extensive use of inclined frequency extenders, both coaxial single sweep and also banded Waveguide. The approach is very convenient for wafer probers where the platen is thermally optimized with insulation layers, to get the very best positioning stability for the probes and positioning mechanics.
One key benefit of this approach is by their very nature, the extenders are further away from the hot wafer chuck which inherently should improve temperature stability. However up until this point our evaluation of these approaches was limited to 220 GHz and ambient conditions only. In the work we contrast and compare the stability of the inclined approach versus direct connected horizontal, both for the ambient and over temperature cases. T-wave probes and waveguide-based infinity probes are used for observations in WR3.4 band.
Risk Mitigation Strategies for mmWave Production Test Environments
Available for on demand viewing
With the 5G mobile network in full deployment, antenna transceivers operating in the 24.25 GHz to 43.5 GHz frequency bands have become integral components of high-end smartphones. These transceivers utilize advanced beam steering and beamforming techniques to optimize wireless data transmission, necessitating precise phase control across up to 32 RF signals. Ensuring these chips are verified as Known Good Die prior to module integration is crucial, demanding probe cards and testing equipment that deliver laboratory-grade precision in RF measurements at production scales.
Employing membrane-based probe technologies meets the electrical demands which results in higher forces, necessitating meticulous setup and system deflection management to ensure optimal contact performance and durability. This challenge is further compounded when scaling test parallelism to reduce the Cost of Test. For instance, with an eight-site probe head configuration, there are hundreds of nets, nearly a third of them being RF signals, interacting through approximately 5000 probe contacts, and resulting 50-80 kg of probing force.
This presentation delves into several strategies and the utilization of specific equipment to gather empirical data on Actual vs. Programmed Overtravel in multi-site RF probe cards. We will explore how this data informs the development of baseline models for predictive Finite Element Analysis modeling, paving the way for enhancements in future applications. These methodologies mitigate some of the prevalent risks associated with mmWave chip testing in high-volume manufacturing contexts, ultimately contributing to a reduction in the overall Cost of Test.
Making Accurate and Consistent Wafer Measurements with Next Generation Guarded True-Kelvin MEMS DC Probes
Available for on demand viewing
Gate length down-scaling of silicon-based transistor results in very small on-state drain-source resistance, making it challenging for test engineers to perform precise and repeatable wafer measurements. Size reduction of aluminum-capped copper test pads to save on lithography, prototyping and production costs implies that it is very difficult to re-probe the same device with low contact resistance. Novel true-Kelvin MEMS analytical DC probes, new test and modelling strategies are proposed in this work to address these emerging test challenges.
使用下一代Guarded, True Kelvin MEMS 直流探针進行準確、一致的晶圓測量
Available for on demand viewing
Gate length down-scaling of silicon-based transistor results in very small on-state drain-source resistance, making it challenging for test engineers to perform precise and repeatable wafer measurements. Size reduction of aluminum-capped copper test pads to save on lithography, prototyping and production costs implies that it is very difficult to re-probe the same device with low contact resistance. Novel true-Kelvin MEMS analytical DC probes, new test and modelling strategies are proposed in this work to address these emerging test challenges.
How to Build a Quantum Computer- A FormFactor & Tabor Electronics Collaboration
Available for on demand viewing
Quantum computing is reaching an inflection point. Once a technology developed and operated in experimental labs, is now being manufactured by large-scale industrial companies. The commercialization of superconducting quantum processing units (QPUs), FPGA-based microwave synthesis electronics, and ultra-low-temperature refrigerators, has resulted in the realization of a commercial-off-the-shelf, full-stack quantum systems. Such full-stack systems can be operated with ease by the end-user and enable rapid testing and characterization of qubit systems, significantly reducing the cost and time involved in such measurements and allowing for further advancements in quantum computing technology.
In this webinar we show the results of an industry collaboration between Tabor Electronics and FormFactor, Inc. using the QuantWare 5-qubit QPU. We detail the system architecture and show the results of qubit characterization. The 5-qubit QuantWare Soprano QPU is installed in a LF-600 dilution refrigerator provided by FormFactor, Inc with measurement and control performed using the Tabor Proteus P9484M-AWT PXI platform and Tabor’s Qubit Characterization software.
Quantum and CryoCMOS: Enabling the Future of Computing with Advanced Test & Measurement Tools
Available for on demand viewing
Advanced computing and quantum computing devices require cryogenic conditions for the processor itself as well as the control chips that drive microwave signal to the processor. These advanced devices typically include niobium or aluminum superconducting circuits, and their support chips are based on cryogenic compatible CMOS structures. Bringing this new technology from the research and development phase, out of the lab and into engineering scale production and ultimately volume production requires specialized tools to test, measure, and deploy the advanced devices all in sub-4K environments. The major bottlenecks include time-consuming wire bonding, expensive packaging processes prior to device cooldown, and long cooldown times for dilution refrigerators.
FormFactor is the leading enabler of quantum computing developers with its suite of cryogenic test and measurement tools as well as deployment solutions. We discuss a customer case study implementing cryogenic wafer probing on SFQ circuits to obtain statistical datasets in hours that would otherwise take weeks or months, a new tool for rapid die testing that makes use of a cryogenic high-density MEMS probe head, enabling photonics probing below 2K, and the deployment of quantum devices in milli-Kelvin dilution refrigerator cryostats with a probe socket interface.
COMPASS 2023 - Video Presentations Available
Available for on demand viewing @ compass.formfactor.com
The 2023 COMPASS Theme is Megatrends in Test and Measurement
FormFactor’s COMPASS test and measurement community event brings together FormFactor customers from around the world to discuss the products and technologies shaping our future. Industry leaders and speakers from corporations, leading-edge research institutions and FormFactor share test insights on a wide variety of emerging applications including 5G, trends in advanced packages, next generation memories and other devices, ultra-low noise testing, cryogenic probing and millimeter-wave measurement and calibration.
Next Generation DC Probes for Accurate and Repeatable Device Modelling Measurements
Available for on demand viewing
The semiconductor industry continues to see the relentless downscaling of gate length and development of new architectures for silicon-based transistor to 2 nm and beyond. The on-state currents of such advanced transistors are increasing with decreasing supply voltages. Their off-state currents are kept very low to reduce power consumption. Smaller test pads to reduce lithography costs and the use of copper backend metallization have increased the difficulties for probes to have low and stable contact resistance as there are little fresh pad metal available for deeper probe scrubs or re-probing. These issues aggravate especially at elevated temperatures when the pad aluminum cap layers have been probed and their underlying copper metallization oxidize rapidly, hindering the ability to achieve good probe contacts. In this talk, we introduce the next generation advanced guarded DC probes with small probe scrubs, low leakage performance and true Kelvin force sense probe tips to address the test challenges of making precise and consistent device modelling wafer measurements.
Making Traceable and Accurate sub-THz Measurements for Wafer Test Applications.
Available for on demand viewing
To support the development of 6G and beyond mobile communication products, wafer S-parameters and RF measurements at sub-THz frequencies are becoming common, daily measurements for test engineers. Accuracy, repeatability and traceability in tests, particularly for active devices, are necessary requirements as test engineers collaborate among their colleagues and customers in labs of various geographical locations. In this talk, based on published IEEE papers, we are going to discuss how probe tip power calibration, continuity checks in banded sub-THz measurements, probe tip contact resistance monitoring as well as best practices in autonomous over-temperature high frequency measurements, can help to address these evolving test requirements.
Considerations for Vertical High Probe Count Testing
Available for on demand viewing
As semiconductor suppliers strive to increase their throughput and lower their test costs, probe card parallelism continues to increase. State of the art probe card designs require up to 80,000 probes and the industry is driving for as much as 150,000 probes in the future. Where are the limitations? Total probe force will be >200 kgf and while there are testers that can handle this amount of force, probe card deflection needs to be considered to maintain high volume production requirements.
Today, the ratio of actual overtravel on the probes to the programmed overtravel can be as low as 30% which makes achieving low contact resistance between probe tip and wafer a challenge. Increasing probe card stiffness is simple in theory but the space constraints between probe card and tester plus the need to populate the PCB with many components makes this very difficult to achieve. In addition to the tester, the prober and probe card metrology tools will need to accommodate this higher force as well.
This webinar will provide a survey of the test equipment industry and identify the chief limitations including where probe card mechanical design needs to improve.
Scaling Measurement Methodologies Using Cryogenic TaaS Framework for Higher Quality cryo-LNAs and Reliable Qubit Readout Chains
Available for on demand viewing
As superconducting quantum computers scale, cryogenic microwave components in the qubit control and readout chain must be appropriately tested and qualified to ensure the consistency and high fidelity of quantum computation. Furthermore, system uptime is critical for commercialization, which is dependent on reliably predicting maintenance cycles and expediting downtime recovery. Both requirements highlight the need for standardized measurement protocols to scale the test capability in the industry. Here we will examine a test framework where we describe procedures for conducting functional, reliability, and integrated testing on cryogenic components. Our pilot use-case investigates calibration and test methodologies for gain and noise figure measurements of low temperature LNAs. Finally, we will discuss how to scale these measurements for high volume reliability testing.
New: Entry-Level Silicon Photonics Solution for Fundamental Research
Available for on demand viewing
FormFactor introduces a cost-effective silicon photonics measurement solution to support fundamental research work for emerging applications.
Designed into the system are FormFactor's years of experience developing automated photonics measurement systems – now tailored to the needs of universities and other entry-level users. Leveraging its intuitive design, the MPS150-SiPh is the perfect solution for less experienced users to discover photonics and achieve highest accuracy test results.
- Supports both surface coupling and horizontal edge coupling
- Aligns optical fibers to couple light in and out of a device without physical contact
Learn how this new solution can help entry-level photonics researchers achieve:
- Optimal measurement performance by precise placement of optical fibers
- Better precision through theta angle adjustment of optical probes
- Faster measurement results with optional, automated positioners
- Coverage of multiple probing applications by converting the platform for use in RF, IV/CV or failure analysis in just a few steps
FRT MicroProf® PT – A New Metrology and Inspection Solutions for Advanced Packaging
Available for on demand viewing
Fan-out panel level packaging is currently one of the latest assembly and packaging trends in the system-in-package world, meeting the increasing demands for extreme miniaturization and rising system requirements at reduced production costs.
This webinar will introduce a NEW solution- the FRT MicroProf® PT, a semiconductor metrology and inspection tool for rectangular panels up to 600 mm — containing 4-5X more dies compared to a 300 mm wafer and equipped with SurfaceSens™ technology. We'll discuss these important features:
- Metrology and defect inspection applications in one tool
- Full automation with two loaders for panel FOUPs, for panels up to 600mm x 600mm in a SEMI-compliant EFEM
- Multi-sensor setup including topography, field-of-view and film thickness with hybrid software evaluation to evaluate highly complex structures
- Film thickness measurements from micron-range down to tens of nanometers
- Wide range of handling capability – from substrates a few millimeters thick to 200µm, including organic and glass
FRT Metrology specializes in fully automated multi-sensor metrology system for application-specific advanced packaging (ASAP) measurements from development to production (lab to fab). We will also cover interesting challenges this new technology means for metrology and inspection such as measuring via-like structures in patterned photoresist and handling large panels instead of wafers.
WinCal 5 Software: Improved Functionality and Features for Better Test Outcomes
Available for on demand viewing
For more than 30 years, WinCal has been the market-leading RF calibration software. In recent years, improvements in usability and features have made the software the best-in-class for RF test and measurement. The latest version of WinCal 5.0 builds upon these improvements and offers even more functionalities.
Attend this webinar and learn:
- An overview of the new modernized WinCal 5.0 user interface
- New 1-port Least Square Calibration algorithm
- Strategies to leverage the software's vast capabilities for measurements and post-processing
We will discuss the new user interface approaches to streamline fast and efficient system configuration and operation. This includes increased homogenization with our market-leading Velox™ probe station control software. We will show the groundbreaking work space approach to dynamically optimize the measurement environment and suit device and measurement needs.
Advances in Analytical Wafer Probing of High-voltage / High-current Devices
Available for on demand viewing
With electric vehicles and other high-power applications gaining momentum, the development of new high-voltage/high current semiconductor devices is ramping up. Wafer test of these power semiconductors poses unique challenges, with test currents of more than 500 Amps and test voltages up to 10 Kilovolts. Designers of these new devices are pushing the limits of physics by shrinking the distance between contacts and requiring test temperatures up to 200° C. In addition, new materials such as silicon carbide and gallium nitride are growing in popularity, adding new complexity to carry out testing in an environment that suppresses electrical arcing, provides low contact resistance of the probe to the device, and low contact and thermal resistance with uniformity between the wafer and chuck. Analytical and engineering probing is key in the research and development of these leading edge semiconductor technologies.
A Beginner's Guide to Quantum Computing
Available for on demand viewing
| Quantum computing promises to revolutionize the way we address complex issues and deliver world-changing solutions in medicine, security, finance, defense, climate, energy, and more. Around the globe, governments, universities, and industry players of all sizes are investing tens of billions of dollars in the race to transform this amazing potential from theory into reality in the next few years.
In this webinar, authors Dr. Hiu Yung Wong and Dr. Zuyu Zhao will share their expertise in quantum computing. Attendees will learn:
Twenty webinar attendees will be randomly chosen to receive one of their works, “Introduction to Quantum Computing, From a Layperson to a Programmer in 30 Steps,” (Dr. Hiu Yung Wong) or “Cryogenic Engineering and Technologies, Principles and Applications of Cryogen-Free Systems,” (Dr. Zuyu Zhao / Dr. Chao Wang). Register today! |
Best Approaches for Sub THz Over Temperature Wafer Test
Available for on demand viewing
Wafer probing has been done for some time in waveguide at frequencies up to several hundreds of GHz. However solutions were typically limited by the constraints of large format extenders with large format positioners, which could limit the capabilities for over temperature work or RF performance.
Recent advances from Virginia Diodes Inc. and Formfactor, have allowed for solutions that allow optimal path lengths and the ability to isolate the extenders from elevated thermal temperatures while still also carrying out cold / dry / dark measurements.
Delivering Advanced mm-Wave Load-Pull Measurements
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The ramp-up of 5G mm-Wave technologies comes with substantial enhancements in connectivity, promising to revolutionize our world. A fundamental requirement of 5G devices is to maximize performance by optimizing the power and/or effciency of the amplifiers and transistors. This is done by measuring the performance characteristics of the device at different impedances that are systematically changed using load-pull tuners.
FRT Metrology for Advanced Packaging - Ensuring the highest quality control of grinding and dicing processes for DISCO Hi-Tec Europe
Available for on demand viewing
Advanced packages have enabled the industry to develop new flip-chip processes, 2.5D interposer and TSV technology, and 2D and 3D fan-out processes with high densities of connections in the smallest of spaces. With these new innovations, the need for flexibility in wafer metrology and handling has exploded. FormFactor MicroProf® AP metrology tools are specifically designed to address an extensive list of advanced packaging format and application challenges.
New Solutions for Analytical Wafer Probing of Silicon and Wide Band Gap Power Devices
Available for on demand viewing
The increasing use of electric vehicles, renewable energy sources, and other high-power industrial applications continues to drive the development of new high-voltage/high current semiconductor devices. While wide band gap (WBG) based devices have many advantages in high power circuits, time to market constraints often dictate the need to test these types of advanced devices on-wafer.
Wafer test of these power semiconductors poses unique challenges, as they often require test currents of more than 500 Amps, test voltages up to 10 Kilovolts and test temperatures up to 200° C. In addition, the wafer probing environment creates additional concerns such as the potential for electrical arcing, the need to minimize probe contact resistance to the DUT, and the requirement to maintain low contact and thermal resistance between the wafer and chuck.
This webinar will cover the basics of on-wafer power semiconductor device test, review the challenges listed above, and explain the solutions available to meet these challenges. After listening to this webinar attendees will have a much better understanding of the issues involved with testing advanced power devices on-wafer.
Overcoming Challenges for Wafer-Level Low Frequency Noise Measurements
Available for on demand viewing
The development of next generation semiconductor device technology nodes targeted for communications, memory, imaging and various analog applications requires advanced wafer level low noise test and measurement capabilities. Flicker noise (1/f), random telegraph noise (RTN), and phase noise have been demonstrated to affect device behaviour and final circuit performance. In today's test labs, it is vital that test engineers are able to accurately measure the device or circuit noise characteristics in a quiet wafer test environment. For this talk, we will first look at the different types of low frequency noise, how they are measured and their impact on devices as well as various circuit applications. We will also discuss the requirements of a quiet wafer test environment and the challenges of achieving one. Finally a wafer test solution that allows test engineers to make accurate low frequency noise measurements will be presented at the end of this talk.
克服晶圆级低频噪声测量的挑战
Overcoming Challenges for Wafer-Level Low Frequency Noise Measurements*
Available for on demand viewing
The development of next generation semiconductor device technology nodes targeted for communications, memory, imaging and various analog applications requires advanced wafer level low noise test and measurement capabilities. Flicker noise (1/f), random telegraph noise (RTN), and phase noise have been demonstrated to affect device behaviour and final circuit performance. In today's test labs, it is vital that test engineers are able to accurately measure the device or circuit noise characteristics in a quiet wafer test environment. For this talk, we will first look at the different types of low frequency noise, how they are measured and their impact on devices as well as various circuit applications. We will also discuss the requirements of a quiet wafer test environment and the challenges of achieving one. Finally a wafer test solution that allows test engineers to make accurate low frequency noise measurements will be presented at the end of this talk.
*This webinar will be presented in Chinese language.
RF Wafer Probing Fundamentals
Available for on demand viewing
An introduction to RF on-wafer probing and calibration. This webinar will expand your knowledge of techniques and tools available to properly characterize RF devices. The webinar is intended for persons interested in RF testing, with beginning knowledge of the physics and characteristics of RF semiconductors.
Scanning SQUID Microscopy – Eliminate the guesswork in the design of resilient superconducting circuits
Available for on demand viewing
FormFactor invites you to learn more about scanning SQUID microscopes – their history, applications, and the latest advances for superconducting quantum computing applications. Join IBM Research Division and Stanford University emeritus Dr. John Kirtley, a world-renowned expert who helped develop the technique of scanning SQUID microscopy, and FormFactor’s Dr. Ryan Murdick, Cryogenic Product Development Scientist, who collaborated on developing the industry’s first fully automated, cryogen-free Scanning SQUID Microscope, the IQ1000. By employing SQUIDs capable of magnetometry and susceptometry, the system allows measurements of local magnetization, magnetic response (susceptometry), and the ability to spatially map electrical currents from the magnetic response. Researchers can now rapidly locate and capture detrimental magnetic vortices in superconducting circuits to enable operationally robust IC design and help accelerate the growth of the superconducting quantum computing market.
Single Sweep Broadband S-Parameter measurements for Semiconductor Transistor and IC Test to 220 GHz
Available for on demand viewing
With the growing demand for consumer devices working in the mm-wave range, including 5G/6G and automotive radar, there is a growing need to enable measurements to go all the way to 220 GHz in a single sweep. Traditionally, measurements beyond conventional coaxial frequency limits often requires more than 1 measurement to cover the broader frequency range of interest, demanding the performance levels that are equivalent to conventional coaxial approaches.
In this webinar we will present a new optimized single sweep solution for S-parameters measurements from 900 Hz to 220 GHz. We will also discuss recent developments of RF probes, instrumentation, calibration standards, and techniques that allow easy, accurate, repeatable, and trustworthy data.
Strategies for Enabling Quantum Development with Test and Measurement from 77K down to milli-Kelvin
Available for on demand viewing
Quantum computing will likely utilize numerous new technologies which operate at different cryogenic temperatures. For example, a quantum computer might deploy CMOS memory modules at 77K, superconducting control chips at 4K, and a quantum processing unit (QPU) at less than 20 mK. To develop and deploy these various subsystems and technologies, it is vital to reliably and efficiently test and measure them at or near their operating temperatures.
Superconductor and Spin Qubit Pre-Screening - Accelerate Quantum Development
Available for on demand viewing
FormFactor and Keysight invite you to learn how to speed development cycles for advanced quantum development. The companies have collaborated to develop an integrated measurement solution for pre-screening qubit devices at mK temperatures. The solution eliminates wire-bonding and packaging from cryogenic test processes to provide critical qubit performance parameters at 50 mK, enabling streamlined deployment in existing dilution refrigerators at 10 mK to reduce development cycle times by more than 2X. The turnkey measurement solution is fully optimized for qubit pre-characterization applications which removes the time-consuming process of selecting and integrating each individual piece of equipment.
Unattended RF Measurement and Calibration for 5G Device Characterization and More
Available for on demand viewing
New generations of 5G devices can have dozens of RF channels operating at high frequency, creating a need for a greater on wafer test volume. In engineering, more device tests are needed to support the expanded speed bands, increasing the workload to complete testing. How can test engineers manage the load? What if the probers could operate unattended -- start a test and measure during a whole shift, overnight, or even over the weekend? There is a real, hands-free solution that provides fast, accurate measurements with high throughput -- leading to more accurate design models and faster time to market.