MEMS: Micro-Electro-Mechanical Systems
Addressing the challenges of advanced 2.5/3D packages, the wide temperature requirements to test ICs for the automotive industry, the emerging needs for high bandwidth and excellent signal integrity in RF applications, and reducing the cost to test thousands of DRAM memory devices in a single touchdown – FormFactor MEMS probe cards are at the forefront of IC innovation.
What is MEMS? In this short animated presentation, we show you how we fabricate our unique MEMS probes, the integral elements of our advanced wafer probe cards.
FormFactor MEMS Podcast Series (Episode 1): What is MEMS and How is it Used in Wafer Probe Testing?
FormFactor’s Chief Technology Officer Jarek Kister describes MEMS technology and how FormFactor uses sophisticated MEMS metallization to build millions of tiny robust electrical springs capable of testing ICs over more than a million contact cycles (touchdowns).
FormFactor MEMS Podcast Series (Episode 2): MEMS – The Solution to Test Challenges
FormFactor’s Chief Technology Officer Jarek Kister discusses the application of MEMS to high parallelism wafer probing and how FormFactor’s MEMS technology solves challenging microprocessor test requirements.
FormFactor MEMS Podcast Series (Episode 3): – Hybrid MEMS
FormFactor’s CTO Jarek Kister explains how the company’s Hybrid MEMS technology enables engineers to balance contact force, high current carrying capability and ultra-fine pitch to optimize for advanced wafer probe requirements.
MEMS - Technical Papers
Best Overall Presentation - SWTEST Asia 2019
FormFactor’s Takao Saeki unveils Takumi CL, a new low-impact parametric MEMS probe card for low-leakage and small pad size applications. Featuring a new 2D MEMS spring and contact tip, the Takumi CL offers a consistent small scrub mark over the life of the product, with the benefits of low cost and fast manufacturing lead time.
In this paper, we discuss overall industry trend of automotive IC growth and technology trends, wafer test challenges and FromFactor’s solution to enable massive parallel testing of >=128 DUT parallel test on automotive micro-controller device, from -40C to 160C. We will also share extensive engineering characterization results on prober deflection and thermal behavior, high pin count probe card AOT vs. POT, low force MEMS probe on wafer pad to achieve zero defect IC wafer probing requirements.
Hybrid MEMS technology allows multiple probe designs to be used in a single probe head design, with each probe design optimized for a specific purpose. The technical innovation to enable Hybrid design is to leverage multi-layer composite MEMS fabrication technology, which allows the optimal wafer test performance by including otherwise mutually exclusive requirements such as fine-pitch and high current carrying capability.
In this paper, FormFactor’s Alan Liao lookas at SoC chip packaging trends and the driving force of CuPillar packaging. The presentation includes the test challenges of fine pitch CuPillar HVM probing, and the need for MEMS probe technology for fine pitch CuPillar HVM testing.
MEMS - News & Press Releases
LIVERMORE, CA – (Globe Newswire – May 29, 2020) – FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today announced the release of the SmartMatrix 3000XP probe card, reaching another high-throughput milestone in DRAM wafer test . The new SmartMatrix 3000XP probe card allows DRAM manufacturers to test 3000 die or more in…
MEMS - from the FormFactor Blog
We recently announced the availability of our new Altius™ vertical MEMS probe card designed to address the wafer test challenges associated with 2.5/3D advanced packaging technologies. Adoption of advanced packaging is accelerating thanks in part to the classic Moore’s Law and transistor shrink diminishes. Advanced packages enable the heterogenous integration of multiple different die through…
In a heterogenous Integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage. From a test perspective, making chiplets a mainstream technology depends on ensuring Good Enough Die at a reasonable test cost. Wafer-level test plays a…
The automotive semiconductor market is growing quickly, with predictions between 3 and 14% CAGR between 2016 and 2021, reaching $43 billion by 2021. The number of semiconductors in automobiles increases in today’s more modern vehicles thanks in part to critical safety systems, greater fuel efficiency technologies, navigation and communications enhancements, comfort and entertainment features, and…
In the world of advanced packaging, wafer test has become more important than ever. We are leading the way with solutions for the toughest problems—today. With the reality that Moore’s Law is approaching its practical end, our industry has applied its creativity towards advanced packaging to continue to achieve performance and cost goals. In the…
Fan-out Wafer Level packaging (FOWLP) is one of the fastest growing advanced packaging segments today. Its growth was ignited when the iPhone 7 A10 processor incorporated the fan-out techniques for their high-end mobile application processors. According to Yole Research, FOWLP is expected to grow to $2.5B by 2022, up from $320 million in 2016. FOWLP…
The Pyrana and Katana-RF probe cards deliver excellent signal integrity, low ground inductance and individually compliant contacts for RF devices up to 10 GHz as well as inductance-sensitive applications. The Pyrana probe cards are a combination of Pyramid probe cards and Katana-RF probe cards and combine their best features – integrating the Katana MEMS probe…