Supports high-density flip chip wafer testing for devices such as cutting-edge microprocessors and SoCs
To meet consumer demand for portable computing products that are attractively priced, consume less power and offer “always on” connectivity, the semiconductor industry has stepped up with advances in process and packaging technologies.
While leading-edge semiconductor technologies deliver important advantages for low-cost and low-power applications, they present significant challenges for wafer testing. For example, wafer test faces stringent electrical performance requirements, and continued scaling in pad pitch, density and probe force, combine to lower cost and cycle-time trajectories to meet the demands of consumer-driven end markets.
FormFactor addresses these challenges with the industry’s broadest portfolio of non-memory wafer test probe cards offering high parallelism for greater throughput, stable contact resistance for optimal test yield, and superior contact precision. Through on-going investments in its technology, the company can quickly scale to meet customers’ future technical roadmap requirements for performance and geometry shrinks. FormFactor delivers a suite of advanced MEMS, vertical and cantilever probe cards.
The Vx-MP probe card supports high-density flip chip wafer testing for devices such as cutting-edge microprocessors and SoCs. It’s designed to provide high-signal fidelity and current-carrying capability, while delivering long product life with minimal maintenance. The Vx-MP is the product of choice for leading-edge microprocessors and SoCs. An advanced probe card, it supports high-density flip-chip wafer testing. Valued for providing high signal fidelity and very high current-carrying capability, it’s also known for long product life and low maintenance requirements.Applications:
Vx-MP Key Features
- 2D Vertical MEMS probe technology, scalable to 90 µm and below
- Ultra-stable Cres on Cu bumps
- Proprietary CoolProbe™ technology to support extreme current requirements
- Low probe force to reduce bump damage
- Cu pillar bump probing, minimum grid-array pitch of 90 µm
- Composite MEMS probe structure to enable high CCC >=1A/probe