Cascade
CM300xi-SiPh
300 mm semi-/ fully-automated probe system with Autonomous Silicon Photonics Measurement Assistant
CM300xi-SiPh Overview
Proven technology and verified measurements make a difference
The CM300xi-SiPh 300 mm Probe station is the first verified integrated measurement solution on the market that enables production-proven, optimized optical measurements right after installation – without further development. The unique Autonomous SiPh Measurement Assistant provides a groundbreaking set of calibration and alignment tools, the powerful SiPh-Tools software package, and all tools and fixtures needed to enable you to measure your photonic devices in days instead of months or years.
Applications: Silicon PhotonicsCM300xi-SiPh Key Features
Validated integration
- All necessary tools, fixtures and calibration techniques included
- No further development needed –start measurements right after installation
Verified performance
- Specified performance parameters
- Validation tests before shipment and after installation
Automated calibrations and alignments
- Automated optical probe calibrations and alignments along with wafer and probe height training
- Unique Pivot Point Calibration
- Optical scan, gradient search functions and sub-die management for combined optical and automated electrical probing
Reconfigurable Fiber Arms with Light Guide Technology
- Flexibility for engineering and volume environments
- Configurable between single fibers and fiber arrays
- Specially designed Z-Displacement Kit regulates the distance between wafer and fiber(s)
SiPh-Tools software package
- Automates manual tasks by integrating probe station vision capability with optical positioning and test equipment
- Wide range of tools for capturing, logging and interpreting the collected data
Videos
Autonomous Silicon Photonics Measurement Assistant
FormFactor's Autonomous Silicon Photonics Measurement Assistant enables and optimizes silicon photonics coupling. The use of single optical fibers and fiber arrays as probes to couple light into and out of a wafer surface creates many challenges that FormFactor manages through its Contact Intelligence technology.
