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PA300DSP Data Sheet
The PA300DSP is the most precise and flexible semiautomatic double-side test solution for wafers and substrates up to 300 mm. It is ideal for all applications requiring access to both the top and back sides of the wafer, such as failure analysis with emission microscopes, optoelectronic test (e.g. spectrum analysis), MEMS test (e.g. Si-microphones) and testing 3D stacks like through-silicon vias (TSVs).
Created: August 15, 2017 | Updated: August 15, 2017 | Type: pdf | Size: 1.44 MB