Probing 25 μm-diameter Micro-bumps for Wide-I/O 3D SICs

Direct micro-bump probing is proving to be a more cost-effective and technologically complete method than dedicated prebond probe pads. However, it requires advanced probe cards and probe stations. Recent work on test wafers has resulted in successfully probing single-channel wide-I/O micro-bumps at 25 μm diameter. Work continues to further prove out this methodology on actual Wide-I/O DRAM.

Created: August 23, 2017 | Updated: January 9, 2019 | Type: pdf | Size: 1.74 MB

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