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Complex Impedance Matching Structures for Advanced On–Wafer AiP

The growing demand for more integrated and miniaturized solutions in modern wireless communication systems is driven by the increasing frequency of operation and operational bandwidths. One significant development in this direction is the integration of antennas directly onto the chip or within the package of the wireless device. This concept is known as "antenna-on-chip" (AoC) or "antenna-in-package" (AiP). The integration of antennas (either AoC or AiP) in the package provides numerous advantages, including the reduction of parasitic effects, improved electromagnetic performance, improved efficiency, miniaturization of the system, simplified design, etc. In this work, we present complex impedance matching structures embedded in FormFactor's Pyramid Core that will play a major role in improving wafer test coverage with better yield and lower cost of ownership (COO) as immediate benefits.

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