FormFactor recently spoke at the Test Vision Symposium, part of SEMICON West 2021. This year’s event was a hybrid online, live event. FormFactor spoke on the following topics as part of the From Nanometer to Terahertz: Future Test Innovation Opportunities and you can now download these presentations:

Temperature Test Challenges and Trends 

Amy Leong, SVP/CMO/GM Emerging Growth Business Unit – Too Hot to Test for Leading-edge SoC and Heterogenous Integrated IC Stack

Learning snapshot:

  • Increasing thermal challenges to test leading-edge SoC, full-wafer memory, and heterogenous integrated device require liquid cooled wafer chuck systems for high power dissipation 
  • Customer case study showed ATT’s Low Thermal Resistance (LTR) chuck enables 
  • Full Wafer Contact up to 2KW 
  • 100x100mm up to 400W – higher power possible with stronger chillers 
  • 21x20mm up to 160W – higher power possible with stronger chillers 
  • Wafer test requirements are changing dynamically – Power densities, Parallelism, IC complexity 
  • ATT is working on new chuck concepts addressing future requirements – Please contact us for more details

Download the complete presentation here.

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mmWave and THz 

Daniel Bock, Advanced RF Applications Specialist and Brandon Liew, RF Product & Applications Engineering Manager – 5G: The Phanerozoic Eon of Parallelism

Learning snapshot:

  • Significant cost savings by going to higher parallelism
  • Pyramid product is ready for the parallelism challenge
  • >55 GHz bandwidth
  • Thin film membrane technology enables high density routing and loopbacks
  • High RF channel count support with RF switches and compact connectors
  • FormFactor has a complete solution to provide full test capability of AiP chips to support the 5G mmWave ramp

Download the complete presentation here.

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Big Digital Test Challenges and Trends 

David Raschko, Product Marketing Manager – Digital Revolution: PAM4 Wafer Test

Learning snapshot:

  • The requirements for PAM4 vs NRZ indicate that probe card specifications should be more stringent than that for NRZ probe cards
  • As complexity of digital test increases, simulation partnerships with equalization will need to be developed 
  • FFI Products are ready for the challenges being presented by the move to PAM4 with custom solutions

Download the complete presentation here.

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Test Innovations in Memory 

Myung Jin Lee, Director, Product Marketing – From Nanometer to Terahertz: Future Test Innovation Opportunities

Learning snapshot:

  • KGD, KGSD Test Demand Increase along with Advanced Packaging 
  • KGSD Test Requirements Continue to Challenge Probe Card Technology 
  • Test speed requirement continues to increase (from 800MHz to 3.2GHz) 
  • KGD, KGSD test requires better test efficiency to reduce cost and support higher volume 
  • FormFactor HFTAP probe card now supports K32, K40 with 128 DUT (max)

Download the complete presentation here.

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Enjoy the presentations!