Introducing the Altius Vertical MEMS Probe Card for Advanced Packaging Technologies
February 27, 2020
Altius enables cost-effective wafer or die test of a variety of components in a heterogenous integrated system, from validating at-speed performance of high bandwidth memory (HBM), to ensuring the integrity of high-density interconnects such as silicon interposers and embedded bridges.
February 24, 2020
From wafer test perspective, what is the biggest challenge to make chiplets a mainstream technology?
The impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and c...
December 6, 2019
Advanced Packaging – Measuring Deep Etch Trenches
Thanks to its parallel illumination, the WLI PL is excellently suited for the measurement of plasma diced etch trenches with a high aspect ratio, sinc...
September 26, 2019
At the Forefront of Testing New Advanced Packages
FormFactor is at the forefront of testing new advanced packages, and working with the industry’s leaders, we’re helping them with their challenges...