Multi-Sensor Measurement – Protecting Against Package Counterfeiting
July 12, 2021
Product and packaging counterfeiting is big business for the bad guys and detrimental to brands and consumers. Today’s manufacturers are continually on the hunt for ways to label their products in such a way that protects their reputation and brands, and saving countless money in lost revenue.
February 27, 2020
Introducing the Altius Vertical MEMS Probe Card for Advanced Packaging Technologies
Altius enables cost-effective wafer or die test of a variety of components in a heterogenous integrated system, from validating at-speed performance o...
February 24, 2020
From wafer test perspective, what is the biggest challenge to make chiplets a mainstream technology?
The impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and c...
December 6, 2019
Advanced Packaging – Measuring Deep Etch Trenches
Thanks to its parallel illumination, the WLI PL is excellently suited for the measurement of plasma diced etch trenches with a high aspect ratio, sinc...