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  • Introducing the Altius Vertical MEMS Probe Card for Advanced Packaging Technologies

    Introducing the Altius Vertical MEMS Probe Card for Advanced Packaging Technologies

    February 27, 2020

    Altius enables cost-effective wafer or die test of a variety of components in a heterogenous integrated system, from validating at-speed performance of high bandwidth memory (HBM), to ensuring the integrity of high-density interconnects such as silicon interposers and embedded bridges.

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  • From wafer test perspective, what is the biggest challenge to make chiplets a mainstream technology?

    February 24, 2020

    The impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage. From a test perspective, making chiplets a mainstream technology depends on ensuring Good Enough Die at a reasonable test cost.

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  • csm Wafer with Trenches 3D

    Advanced Packaging – Measuring Deep Etch Trenches

    December 6, 2019

    Thanks to its parallel illumination, the WLI PL is excellently suited for the measurement of plasma diced etch trenches with a high aspect ratio, since a large proportion of the light reaches the bottom of the etching structure and the depth can thus be measured.

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2019

September 26, 2019

At the Forefront of Testing New Advanced Packages | READ MORE