Blog
4 Challenges When Testing Si and Advanced GaN/ SiC Devices On-Wafer
April 25, 2019
While on-wafer testing methodologies for GaN and SiC power semiconductors (lateral and vertical structures) are similar for Si devices, expanded test capabilities are needed for these newer wide band gap devices.
April 11, 2019
The MicroVac Chuck – Improving Yield and Test Accuracy for Thinned High-Power RF Devices
The patented MicroVac chuck technology provides uniform vacuum across the entire wafer surface. The improved vacuum design minimizes leaks and provide...
February 14, 2019
Exploring Terahertz Applications in Emerging Sciences
Until recently, THz technologies were bulky and expensive systems used only for radio astronomy and lab applications. Today, the technical progress ac...
November 1, 2018
Saluting the Semiconductor Geniuses
From the early geniuses that explained basic semiconductor properties to the invention of the point contact transistor; from developing a formula for...