Introducing the Altius Vertical MEMS Probe Card for Advanced Packaging Technologies
February 27, 2020
Altius enables cost-effective wafer or die test of a variety of components in a heterogenous integrated system, from validating at-speed performance of high bandwidth memory (HBM), to ensuring the integrity of high-density interconnects such as silicon interposers and embedded bridges.
November 26, 2019
Delivering Zero-Defect IC Wafer Test for the Today’s Automotive Market Needs
Validated by key automotive manufacturers and deployed to various tester platforms (T2000, V93K DD, J750), the TrueScale Matrix 300mm wafer probe card...
June 7, 2019
Probe Cards – Online Cleaning Frequency vs. Trade-Offs
Each time you abrasively clean a probe card, the abrasive may remove a small amount of probe tip material in addition to the contaminant. Your cleanin...
March 7, 2019
Validating IC Packaging Requirements for the Connected Car and IoT
As the connected car becomes more and more mainstream, future success continues to depend, in part, on the durability of the semiconductors and chips...
December 20, 2018
Addressing High Parallelism in Production RF Test | READ MORE
November 29, 2018
9 Steps to Determining Online Cleaning Parameters for Pyramid Probe Cards | READ MORE
October 11, 2018
Getting the Most from Pyramid Probe Cards: Training and Certifications | READ MORE
February 16, 2018
4 Key Benefits of the Katana-RF and Pyrana Probe Cards | READ MORE
February 8, 2018
3 Recommended Abrasive Cleaning Media for Online Pyramid Probe Cleaning | READ MORE
January 25, 2018
Probe Card Cleaning 101 – Protecting Your Probe Card Investment | READ MORE