April 28, 2022
The characterization of the bonded wafers is essential because it determines the process quality or the quality of the fabricated devices. Along with destructive techniques for the bond strength evaluation, like tensile or shear testing, optical measurements are often the choice of means.
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April 15, 2022
VCSELs are semiconductor lasers in which the emitted light emerges perpendicular to the chip surface. A VCSEL is formed from a complex multilayer structure that is applied to the substrate by molecular beam epitaxy (MBE) or metal organic chemical vapor deposition (MOCVD).
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March 25, 2022
Microelectronic components and semiconductors are manufactured on round thin discs, so-called wafers. Wafers can be made of various conductive or non-conductive materials such as silicon, sapphire or glass with a typical diameter of 100, 150, 200 or 300 mm.
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February 10, 2022
Listen to how the FRT Metrology integration has changed FormFactor’s potential in the microchip industry. Gain insights from the founder of FRT Metrology and learn why hybrid metrology is a real game changer.
Read MoreOctober 21, 2021
Visit FormFactor FRT Metrology at SEMICON Europa | READ MORE
October 14, 2021
New Technical Brief: Automated Image Acquisition Process Ensures Flat Cell Culture Plates | READ MORE
July 12, 2021
Multi-Sensor Measurement – Protecting Against Package Counterfeiting | READ MORE
February 26, 2021
Hybrid Metrology – Reliable Measurement of Inaccessible Parameters | READ MORE