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  • Repeatability test of SiC thickness

    High Throughput SiC Metrology and Inspection

    March 16, 2023

    See the presentation and Bastian Troger will share examples of defect inspection on silicon carbide products (SiC layer defects) and the determination of the overlay shift on SiC wafers. In addition, Egidio Carria will discuss the market background and acceptance of SiC technology.

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  • Picture says more than a 1000 data

    Data View – A Picture Says More Than 1000 Data Points

    February 8, 2023

    A new module in our Acquire Automation XT metrology software simplifies intuitive fine-tuning. Data View, a new display option integrated into the software, provides instant access to a visual representation of our measurement data.

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  • 5x Faster: Thickness Measurements of Wafers and Layers

    5x Faster: Thickness Measurements of Wafers and Layers

    April 28, 2022

    The characterization of the bonded wafers is essential because it determines the process quality or the quality of the fabricated devices. Along with destructive techniques for the bond strength evaluation, like tensile or shear testing, optical measurements are often the choice of means.

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April 15, 2022

Vertical Cavity Surface Emitting Laser – VCSEL Technology Takes Off! | READ MORE

March 25, 2022

Understanding Wafer Applications in Surface Metrology | READ MORE


October 21, 2021

Visit FormFactor FRT Metrology at SEMICON Europa | READ MORE

July 12, 2021

Multi-Sensor Measurement – Protecting Against Package Counterfeiting | READ MORE

February 26, 2021

Hybrid Metrology – Reliable Measurement of Inaccessible Parameters | READ MORE