In today’s “Connected Car”, advanced electronic systems guide nearly every function, provide infotainment, and enable a safe and reliable driving experience.
This trend has dramatically increased the semiconductor content in every car. Gartner expects the pace to continue, with sales of automotive semiconductors predicted to increase at a CAGR of 7.5% from now through 2017.
Requirements for Successful Testing
High Parallelism Testing
To increase wafer-test throughput. With embedded high-density memory, automotive microcontrollers can involve lengthy test times and higher test costs.
For automotive-grade reliability and quality assurance (when temperatures can reach 150° Celsius and higher.)
Low Probe Force
To avoid probe-related damage to IC structures below the probe pads.
Higher Feature Integration on SoCs
Is driving a steady migration from wire bond packaging to advanced technologies like flip-chip and Cu pillars. The new essentials for these applications are specialized probes that can tackle pitches as tight as 135µm, offer superior current-carrying capabilities, and embody other manufacturing technologies to reduce Cres and improve wafer yield.