We’re excited to announce that FormFactor will be attending VOICE 2025, Advantest’s annual developer conference, where global semiconductor test experts come together to exchange insights, showcase innovations, and explore best practices.

Taking place May 12–14, 2025, in Austin, Texas, VOICE is a premier event for industry leaders and innovators. Visit us at Booth #21 to learn about FormFactor’s latest advancements in SoC, memory, and silicon photonics testing.

SmartMatrix™ 3000XP – High-Parallelism Probe Card for Advanced Memory Test

  • Optimized for full-wafer testing of DRAM, GDDR, HBM, and emerging memory devices
  • Supports over 3000 sites per wafer for high-throughput testing
  • Operates in a temperature range of -40˚C to 125˚C

IntelliFusion™ – DRAM & HBM Core Die Test Probe Card

  • Designed for 300 mm full-wafer testing of DRAM and HBM core die
  • Supports up to 120,000 probes and clock rates up to 1 GHz
  • Temperature range of -40°C to 130°C

Apollo™ – Advanced Probe Card for Flip-Chip and Multi-Site Testing

  • Ideal for area-array and perimeter-layout probing (flip-chip, pre-bump, aluminum pad)
  • Delivers reliable performance for mobile, graphics, and automotive ICs
  • Multi-DUT testing for higher throughput in high-volume environments

TRITON™ – High-throughput Silicon Photonics Test System

  • Developed in collaboration with Advantest and TEL
  • Wafer-level test system for high-volume silicon photonics
  • Integrates optical and electrical testing for comprehensive test coverage
  • Supports surface and edge coupling for flexible device architectures

Stop by Booth #21 to connect with the FormFactor team! We’ll discuss how our technologies enable efficient, high-throughput testing for SoC, memory, and photonics applications.