As quantum computing edges closer to real-world deployment, one challenge continues to stand out – cryogenic I/O. Managing thousands of signals between room temperature, 4K, and millikelvin stages is one of the toughest engineering problems in scaling quantum systems.

In this live webinar, experts from FormFactor and Delft Circuits will dig into the biggest hurdles in cryogenic I/O, share how they’re tackling them today, and look ahead at what’s coming in the next five years.

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As quantum processors grow from dozens to thousands of qubits, the interface between the quantum chip and control electronics becomes increasingly demanding. Cryogenic cables, connectors, and routing systems need to deliver ultra-low noise, minimal thermal load, and strong signal integrity, while still being modular and reliable.

That’s where FormFactor and Delft Circuits come in. Together, we’re rethinking how engineers design and manage these systems, creating integrated cryogenic solutions that bring performance, practicality, and scalability together.

What You’ll Learn

  • The four main bottlenecks in cryogenic I/O, and how each affects scalability
  • Smart strategies for managing I/O across room temperature, 4K, and mK stages
  • New innovations boosting signal integrity, modularity, and long-term reliability
  • How FormFactor and Delft Circuits are aligning their roadmaps to enable scalable quantum systems

This isn’t just another technical overview, it’s a forward-looking conversation about how to design cryogenic systems that are ready for tomorrow’s quantum breakthroughs.