Happy Holidays – Our Six Most Popular Recent Blogs
December 28, 2017
As we head into the New Year be sure to be thankful for all you have and give to others where and when you can, and get ready for an even better 2018! Our blog here at FormFactor is fairly new, but we’re gaining momentum. To send us into the New Year, here's our top six blog posts to date.
All of us at FormFactor would like to thank our customers and partners for a great 2017. As we head into the holidays and the New Year be sure to be thankful for all you have and give to others where and when you can. Be safe wherever your travels may take you and get ready for an even better 2018!
Our blog here at FormFactor is fairly new, but we’re gaining momentum. To send us into the New Year, here are our top six blog posts to date:
- FormFactor in Chip Scale Review: Evaluating Advanced Probe Cards for Large-Array Fine-Pitch Micro-Bumps
Our own Jorg Kiesewetter, Ken Smith, and Eric Hill recently teamed up with imec’s Erik Jan Marinissen, Ferenc Fodor, and Bart De Wachter to co-author an article in Chip Scale Review.
- Small Pad Probing: 5 Problems with Conventional Probes with Multiple Needles
Probing high pad count integrated circuits (ICs) in order to verify functionality has always been a challenge. As pad sizes are getting smaller and the number of on-chip connections are increasing, it’s especially challenging, but with consumer RF devices, the challenge is particularly daunting.
- 4 Features and 4 Benefits of Terminated TRE with the SmartMatrix 1500XP Probe Card
TTRE, high-Impedance DUTLet technology, and the robust 3D MEMS springs extend the SmartMatrix product platform to address probing at ultra-high temperature up to 160C, and test speed to 200 MHz for increased throughput and test coverage, without increasing the overall cost of test.
- Transforming 300 mm Probing with Contact Intelligence Technology
Our CM300xi probe system is the first probe system to deliver integrated Contact Intelligence technology. Contact Intelligence automation targets the realignment process required to synchronize the probe tips with the target pads on the wafer surface.
- Understanding Different On-Wafer Calibration Values with SOLT vs. LRRM
If you use WinCal™ to calculate on-wafer calibration coefficients, you might notice a difference in those values when comparing with built-in SOLT from your Vector Network Analyzer and LRRM. This is normal and here’s why.
- Ramping up Millimeter-Wave Testing for Automobiles Radar Systems
Our own Tim Cleary and Daniel Bock recently penned an article in Chip Scale Review titled, Auto Radar Probe Test Technologies for High-volume Production in which they discussed the needs for today’s onboard integrated circuits and the path to achieving the testing process requirements.
Thanks again for a great 2017! We’ll see you next year!