4 Challenges When Testing Si and Advanced GaN/ SiC Devices On-Wafer
April 25, 2019
While on-wafer testing methodologies for GaN and SiC power semiconductors (lateral and vertical structures) are similar for Si devices, expanded test capabilities are needed for these newer wide band gap devices.
April 18, 2019
Catch FormFactor at PCIM Europe and COMPASS Taiwan in May
FormFactor will be attending PCIM Europe in Germany, May 7-9, and COMPASS Taiwan, May 24. Here are details for both shows, including summaries of the...
April 11, 2019
The MicroVac Chuck – Improving Yield and Test Accuracy for Thinned High-Power RF Devices
The patented MicroVac chuck technology provides uniform vacuum across the entire wafer surface. The improved vacuum design minimizes leaks and provide...
April 4, 2019
Improving Engineer Productivity with Infinity & InfinityXT Probes
The Infinity Probe sets a new standard by ensuring better measurements on aluminum pads, reducing re-probing and errors in measured data. Check out ho...