As we wind down 2025 and get ready to start 2026, it’s time to reflect on the most popular blog posts of 2025. Here are the top 10 posts of 2025.

  1. The Role of 5G Testing in Ultra-Low Latency Applications

Want ultra-low latency out in the real world? It all starts with rock-solid, real-world testing in the lab. Whether you’re building autonomous systems, connected factories, or next-gen wearables, your 5G test setup needs to be as fast and flexible as the devices you’re building.

  1. Pioneering High-Throughput Wafer Testing for Silicon Photonics with TRITON

Developed in collaboration with Advantest and TEL, TRITON brings together cutting-edge automation, optical-electrical integration, and versatile test compatibility, setting a new standard in wafer-level testing.

  1. Wafer Test Challenges and Solutions: How to Ensure High-Performance Semiconductor Manufacturing

From 5G, IoT, and AI applications to advanced packaging and high-bandwidth memory (HBM), ensuring device performance and yield at the wafer level is a critical step in the semiconductor manufacturing process.

  1. The Future of Semiconductor Manufacturing: Trends in Advanced Packaging

Advanced packaging is all about bringing multiple chips together in a single package to improve performance. By leveraging innovative techniques, engineers can combine different components, such as processors, memory, and specialized accelerators, within a unified structure.

  1. High-Speed Test Solutions for Known Good Die Wafer Test on Memory ICs

As semiconductor devices grow more complex, ensuring that each component functions correctly before integration is essential. With multi-chiplet architectures becoming standard, Known Good Die (KGD) testing plays a key role in improving final yield and reducing costs.

  1. From Lab to Fab – Mike Slessor on the Next Decade of Semiconductor Testing

“Testing isn’t just something that happens after the fact anymore,” Slessor said. “It’s part of the design process itself. It helps engineers understand how devices behave in real time so they can learn faster and improve yield more efficiently.”

  1. Redefining Wafer Test, Fully Automated Edge Coupling for Silicon Photonics

At FormFactor, our engineers have collaborated with IHP Microelectronics to develop the industry’s first fully automated wafer-level edge coupling measurement system designed specifically for silicon photonic integrated circuits (PICs).

  1. Overcoming Cryogenic Cabling Challenges within Dilution Refrigerators for Effectively Scaling Quantum Computing

As qubit counts increase, the volume of coaxial cables required quickly overwhelms the available space, creates an excessive heat load that exceeds the DR’s cooling capacity, and presents significant installation difficulties.

  1. Electrical Considerations When Specifying RF and Microwave Probes

In this blog, we’ll explore the key electrical and mechanical factors that affect RF and microwave probe selection, helping you get the precision and consistency your application demands.

  1. Introducing the InfinityXF™ Probe – Redefining Wafer-Level Broadband Testing

Developed in partnership with Keysight Technologies, the probe works seamlessly with the PNA-X system and new 250 GHz coaxial frequency extension modules, using ruggedized 0.5 mm coaxial connectors.

Have a safe and happy holiday and we’ll be back to share more posts in 2026!