With electric vehicles and other high-power applications gaining momentum, the development of new high-voltage/high current semiconductor devices is ramping up. Wafer test of these power semiconductors poses unique challenges, with test currents of more than 500 Amps and test voltages up to 10 Kilovolts. Designers of these new devices are pushing the limits of physics by shrinking the distance between contacts and requiring test temperatures up to 200° C. In addition, new materials such as silicon carbide and gallium nitride are growing in popularity, adding new complexity to carry out testing in an environment that suppresses electrical arcing, provides low contact resistance of the probe to the device, and low contact and thermal resistance with uniformity between the wafer and chuck. Analytical and engineering probing is key in the research and development of these leading-edge semiconductor technologies.

We’re excited to announce a new webinar happing on July 15th that will address the needs and challenges of probing high-voltage/high-current devices. In the webinar – Advances in Analytical Wafer Probing of High-voltage/High-current Devices – Rainer Gaggi, (specialist in the design and manufacturing of high-power wafer probe cards), and FormFactor’s Eric Wilcox, discuss these wafer test challenges and patented high voltage arc suppression technology that provides spark-free probing for high-voltage / high-current devices made with Si, SiC and GaN technology.

There are two opportunities to watch this webinar:

Here’s a little bit about the two speakers:

Eric Wilcox, Director of Marketing, DC and High-Power Market Segments, FormFactor, Inc.

Eric Wilcox is the Director of Marketing for FormFactor’s DC and High-Power Market Segments. Mr. Wilcox has held multiple organizational roles within the company, including Senior Marketing Manager for the Probe Systems business and Product Marketing Manager for the Reliability Test Systems business. Prior to this, Mr. Wilcox was a Senior Applications Engineer in the Center of Expertise at Cascade Microtech, Inc., and was responsible for the worldwide technical leadership of Reliability Test Products. Mr. Wilcox has co-authored multiple papers with industry experts about next generation reliability test methodologies for presentation at some of the premier IEEE reliability conferences and has obtained a US patent for innovative systems and methods of performing electromigration testing. Mr. Wilcox holds a Bachelor of Science in Business Management from the University of Northwestern – St. Paul.

Rainer Gaggl, Founder and Managing Director, T.I.P.S. Messtechnik GmbH

Rainer Gaggl is managing director of T.I.P.S. Messtechnik GmbH and responsible for product and process development as well as strategic sales activities. Mr. Gaggl founded T.I.P.S. in 1997 as a “spin-off” of Siemens Bauelemente; the company today has grown to a more than 80-person workforce headquartered in Villach, Austria. The main focus of his work is on test interfaces for high power devices, automotive ASICS, sensors and MEMS devices, and automotive RADAR. High voltage, high currents and probe cards with sensor stimuli are some of his “playgrounds as a physicist” and he holds several patents in that field. He holds a Ph.D. in Physics from the Technical University of Graz.

We hope to see you on July 15th!