Join us in San Francisco at the SEMICON West and Test Vision Symposium
June 27, 2019
Join us at the Moscone Center in San Francisco, California for the SEMICON West and Test Vision Symposium, July 9 – 11. Our CEO, Mike Slessor, will be giving the Opening Keynote speech on Wednesday and Daniel Bock will present Thursday on 5G Wafer Test, among other participants.
FormFactor will be speaking at SEMICON West and Test Vision Symposium in San Francisco the week of July 9-11. Join us!
At SEMICON West
Societal Challenges – Shaping a Better World
Smart Workforce Pavilion Tuesday, July 09 11:30am to 12:30pm
Do you want to affect change beyond your own walls? The microelectronics industry is the engine for global economic growth, driving fundamental changes in medical, communication, energy and environmental security which will deliver social innovations world-wide. Speakers in the session discuss corporate stewardship, global impact and revolutionary technologies redefining our future. You’re Welcome!
Amy Leong will present at SEMI Smart Workforce day on Societal Impact of FormFactor, supporting SEMI’s initiative as shown in this movie trailer below.
At Test Vision
9:50 – 10:50 a.m.
Mike Slessor will be a Keynote speaker for Test Vision Symposium “Advanced Packaging and its impact on wafer test”
11:20 – 11:30 a.m.
Dan Bock’s award-winning paper from SWTest “5G Wafer Test and New Age of Parallelism” is sponsored by SWTest to be presented at Test Vision:
The development of new RF devices (5G and high-speed digital components) is changing the landscape for RF probing. For many years, RF probing in frequencies beyond cell phone and WiFi frequencies was a niche area, only requiring a very small number of lines as well as not meeting the needs for High Volume Manufacturing (HVM). 5G is leading the way to both higher RF frequencies with the added 28, 38, and 60 GHz bands, as well as the needed improvements in infrastructure with high speed digital devices for data backhaul through the fiber network because of the expected large increase in data needs. The race to meet higher bandwidth for infrastructure development is leading to a new set of requirements because of the increase in channels and volume. Because of this, the requirement for more parallelism at high speeds is leading to new probe card architecture. This includes frequency improvements of vertical MEMS type probe heads, and membrane probe cards with PCB active circuitry to increase the channel density. In addition, to meet the high standards for signal integrity at these high speeds, the relative repeatability of RF measurements per touchdown, RF calibration performance, and probe head inductance comparisons will be reported in order to provide a path for probing technology selection based on the end use requirements.