August 20, 2025
As advanced electronics keep shrinking while delivering more performance, today’s advanced packaging increasingly relies on heterogeneous integration, combining multiple specialized dies into a single multi-chip module (MCM).
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January 23, 2025
Advanced packaging is all about bringing multiple chips together in a single package to improve performance. By leveraging innovative techniques, engineers can combine different components, such as processors, memory, and specialized accelerators, within a unified structure.
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June 27, 2024
Advanced packaging is taking the lead as front-end-driven Moore’s Law slows down, shifting the focus from front-end processes to back-end techniques. Where lithography and etching were once the primary enablers, assembly and testing have now gained greater importance.
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March 14, 2024
FormFactor's probe solutions facilitate the required testing environment for aluminum pads through sort and functional speed tests utilizing FFI’s T11 family of probes, as well as for copper bumps with the vertical MEMS MF family.
Read MoreJanuary 26, 2024
Probe Cards for Every IC in Advanced Packages | READ MORE
May 11, 2023
Advanced Packaging Pushing Wafer-Level Test to the Next Level | READ MORE
July 12, 2021
Multi-Sensor Measurement – Protecting Against Package Counterfeiting | READ MORE